面向三维集成应用的Cu/SiO2晶圆级混合键合技术研究进展
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刘逸群, 张宏伟, 戴风伟. 面向三维集成应用的Cu/SiO2晶圆级混合键合技术研究进展[J]. 微电子学, 2022, 52(4): 623. LIU Yiqun, ZHANG Hongwei, DAI Fengwei. Progress on Cu/SiO2 Wafer-Level Hybrid Bonding Technology for 3D Integration Applications[J]. Microelectronics, 2022, 52(4): 623.