为满足有源相控阵雷达中发射/接收(T/R)组件的小型轻量化发展要求，提出了一种新型的垂直互联结构。从工艺优化的角度，结合低温共烧陶瓷(LTCC)可制作腔体的特性，用高频结构仿真器 HFSS设计了半嵌入式球栅阵列(BGA)垂直互联结构，分析了半嵌入结构对垂直互联传输性能的影响。结果表明半嵌入式 BGA垂直互联结构，在 X波段回波损耗高于 24 dB，插入损耗低于 0.15 dB; 在 Ku波段，依然能实现回波损耗高于 20 dB，插入损耗低于 0.6 dB。该半嵌入式结构在优化工艺的同时，在 X-Ku波段的较宽频段内可实现良好的微波传输性能。

In order to meet the requirements of miniaturization and lightweight development of Transmitter/Receiver(T/R) module in active phased array radar, a novel vertical interconnection structure is proposed in this paper. Semi-embedded Ball Grid Array(BGA) vertical interconnection structure is designed by using electromagnetic simulation software HFSS from the point of view of process optimization, combined with the characteristics of Low Temperature Co-fired Ceramic(LTCC) substrate. In addition, the influence of semi-embedded structure on vertical interconnection transmission performance is analyzed. The results show that the return loss is higher than 24 dB and the insertion loss is lower than 0.15 dB in X-band and 20 dB, 0.6 dB in Ku-band. The semi-embedded structure can achieve good microwave transmission performance in a wide band between X-Ku band while optimizing the process.