[1] HSIEH M, LIN S, HSU I, et al. Fine pitch high bandwidth flip chip package-on-package development[C]// The 21st European Microelectronics and Packaging Conference(EMPC) & Exhibition. Warsaw,Poland:IEEE, 2017:1-5.

[2] 徐达 ,白锐 ,常青松 ,等 .新型 3D射频封装结构的可靠性模拟研究 [J].电子元件与材料 , 2017,36(3):88-91. (XU Da,BAI Rui, CHANG Qingsong, et al. Reliability simulation of new 3D RF packaging structure[J]. Electronic Components and Materials, 2017,36(3):88-91.)

[3] KITADA H, AKAMATSU T, ISHITSUKA T, et a1. 3D packaging technology to realize miniaturization/high-density and high-performance servers[J]. FUJITSU Scientific & Technical Journal, 2017,53(2):15-22.

[4] BHUTANI A,GOETTEL B,THELEMANN T,et al. CPW-to-SL transition in LTCC technology[J]. Electronics Letters, 2017,53(9): 609-611.

[5] 廖承举 ,王辉 ,向伟玮 ,等 .系统级集成射频垂直互连技术 [J].电子工艺技术 , 2017,38(6):319-322. (LIAO Chengju,WANG Hui, XIANG Weiwei, et al. System level integrated RF vertical interconnection technology[J]. Electronic Technology, 2017, 38(6): 319-322.)

[6] 周骏 ,窦文斌 ,沈亚 ,等 .应用 SIP技术的宽带板间垂直互连结构 [J].固体电子学研究与进展 , 2012,32(1):36-39. (ZHOU Jun, DOU Wenbin,SHEN Ya,et al. Vertical interconnection structure between broadband boards using SIP technology[J]. Research and Development of Solid State Electronics, 2012,32(1):36-39.)

[7] HAUHE M S, WOOLDRIDGE J J. High density packaging of X-band active array modules[J]. IEEE Transactions on Components Packaging & Manufacturing Technology:Part B, 1997,20(3):279-291.

[8] 严伟 .基于 LTCC技术的三维集成微波电路研究 [D].南京 :东南大学 , 2003. (YAN Wei. Research on 3D integrated microwave circuits based on LTCC technology[D]. Nanjing,China:Southeast University, 2003.)

[9] 张之光 ,徐正 ,刘骁 ,等 .一种用于瓦片式 T/R组件的垂直互连方式 [J].科学技术与工程 , 2013,13(11):3104-3108. (ZHANG Zhiguang, XU Zheng, LIU Xiao, et al. A vertical interconnection method for tile T/R module[J]. Science, Technology and Engineering, 2013,13(11):3104-3108.)

[10] 万涛 ,王耀召 .小型化层叠式三维 T/R组件 [J].太赫兹科学与电子信息学报 , 2016, 14(5): 758-762. (WAN Tao, WANG Yaozhao. Miniaturized stacked 3D T/R module[J]. Journal of Terahertz Science and Electronic Information Technology, 2016,14 (5):758-762.)

[11] 孙翔宇 .3D-SiP T/R模块集成技术 [C]// 2018年全国微波毫米波会议论文集 (上册 ).成都 :中国电子学会微波分会 , 2018: 453-456. (SUN Xiangyu. 3D SIP T/R module integration technology[C]// Proceedings of 2018 National Microwave and Millimeter Wave Conference(Volume I). Chengdu,China:Microwave Branch of Chinese Society of Electronics, 2018:453-456.)

[12] 蔡茂 .基于三维集成的 X波段接收模块设计与实现 [D].南京:东南大学, 2018. (CAI Mao. Design and implementation of X-band receiver module based on 3D integration[D]. Nanjing,China:Southeast University, 2018.)

[13] 徐利,王子良,胡进,等 .基于毛纽扣的 LTCC微波模块垂直互连技术 [J].固体电子学研究与进展, 2013,33(6):538-541. (XU Li,WANG Ziliang,HU Jin,et al. Vertical interconnection technology of LTCC microwave module based on button[J]. Research and Development of Solid State Electronics, 2013,33(6):538-541.)

[14] 刘江洪,刘长江,罗明,等 .基于毛纽扣的板级垂直互连技术 [J].电子工艺技术, 2016,37(3):135-138. (LIU Jianghong,LIU Changjiang,LUO Ming,et al. Board level vertical interconnection technology based on button[J]. Electronic Technology, 2016,37 (3):135-138.)

[15] 吴金财,严伟,韩宗杰 .微波毫米波多芯片模块三维互联与封装技术 [J].微波学报, 2018,34(2):61-64. (WU Jincai,YAN Wei, HAN Zongjie. 3D interconnection and packaging technology of microwave and millimeter wave multi chip modules[J]. Acta Microwave Sinica, 2018,34(2):61-64.)

[16] 効婧涵 .毫米波多波束 T/R组件关键技术研究 [D].成都:电子科技大学, 2020. (XIAO Jinghan. Research on key technologies of millimeter wave multi beam T/R module[D]. Chengdu,China:University of Electronic Science and Technology, 2020.)

[17] 李丙旺,吴慧,向圆,等 .BGA植球工艺技术 [J].电子与封装, 2013,13(6):1-5. (LI Bingwang,WU Hui,XIANG Yuan,et al. BGA ball planting technology[J]. Electronics and Packaging, 2013,13(6):1-5.)