Low-loss dielectric terahertz (THz) chips are efficient platforms for diverse THz applications. One of the key elements in the chip is the coupler. Most of the available THz couplers are in-plane and couple the THz wave from the metal waveguide to the dielectric waveguide. However, out-of-plane couplers are more suitable for wafer-scale testing and tolerant of alignment variation. In this work, we propose an out-of-plane THz coupler for coupling the antenna to the dielectric waveguide. The device is constructed using a grating and a compact spot-size converter. As the conventional optical spot-size converters that apply directly to THz chips are too large, we have designed a compact spot-size converter based on a tapered waveguide with a lens. The total device is 2.9 cm long and can couple a 7 mm diameter THz beam to a 500 µm wide waveguide. The device can scan the THz beam, radiate the input rectangular waveguide mode to free space, and drive the rotation angle of the fan beam through the scanning frequency. We fabricated the device using a single lithography step on a silicon wafer. The out-of-plane coupling efficiency was found to be ∼5 dB at 194 GHz. The fan-beam steering range was found to be around 40° in the frequency range of 170–220 GHz. The proposed out-of-plane coupling technique may provide an effective way for THz wafer-scale testing with a higher degree of freedom for on-chip integration. Also, the proposed technique being non-mechanical, beam steering using it, may therefore find applications in THz radar, communication, and sensing.

集成太赫兹滤波器是实现集成太赫兹通信系统的基本器件之一，为了使太赫兹滤波器实现片上可调，提出了基于温控系统的太赫兹可调谐滤波器。相比于其他的太赫兹滤波器，提出的片上可调谐滤波器的调谐方法简单，尺寸小，可以很好地与其他太赫兹器件集成到晶片上。利用温控系统改变晶片的温度，再利用硅材料的热光效应改变折射率，使得微环耦合状态发生变化，从而让太赫兹滤波器的谐振峰发生漂移。在将加热片从30 ℃逐渐加温到90 ℃的过程中，太赫兹可调谐滤波器在180 GHz附近的谐振峰中心频率从180.453 GHz逐渐减小到180.224 GHz，变化范围为0.229 GHz，谐振深度从−68 dB逐渐变化为−44 dB，半高宽由原来的0.040 GHz逐渐变为0.246 GHz。