Great strides have been made over the past decade to establish femtosecond lasers in advanced manufacturing systems for enabling new forms of non-contact processing of transparent materials. Research advances have shown that a myriad of additive and subtractive techniques is now possible for flexible 2D and 3D structuring of such materials with micro- and nano-scale precision. In this paper, these techniques have been refined and scaled up to demonstrate the potential for 3D writing of high-density optical packaging components, specifically addressing the major bottleneck for efficiently connecting optical fibres to silicon photonic (SiP) processors for use in telecom and data centres. An 84-channel fused silica interposer was introduced for high-density edge coupling of multicore fibres (MCFs) to a SiP chip. Femtosecond laser irradiation followed by chemical etching was further harnessed to open alignment sockets, permitting rapid assembly with precise locking of MCF positions for efficient coupling to laser written optical waveguides in the interposer. A 3D waveguide fanout design provided an attractive balancing of low losses, modematching, high channel density, compact footprint, and low crosstalk. The 3D additive and subtractive processes thus demonstrated the potential for higher scale integration and rapid photonic assembly and packaging of micro-optic components for telecom interconnects, with possible broader applications in integrated biophotonic chips or micro-displays.

激光在加工微米级小孔径领域中有着明显优势, 尤其是在对于特殊孔形的小孔加工中, 激光可以实现高精度高速度的轮廓描绘。探讨了双光楔旋转打孔激光加工系统在不锈钢、单晶硅等材料上异形孔加工成型的工艺参数, 结果表明更多的重复次数在小孔加工中起着比激光能量更重要的作用。同时实验也利用旋转双光楔扫描器在不同材料表面进行了异形微孔加工, 验证了双光楔系统在实际工业打孔加工应用中的可能性。

近年来,激光精细加工技术在我国的先进制造业特别是微加工领域得到了迅猛的发展,作为一种新兴的加工技术,其有非接触、无磨损、无污染、效率高、附加值高等传统技术无法比拟的先进性和优越性,正在逐步取代现有技术成为精细加工技术主流。研究首先介绍了激光精细加工设备模块化设计的发展背景及重要性。然后,重点分析了各个基础模块,介绍了关键功能模块。接着,论述了模块的一体化控制技术和通讯接口技术。最后,对研究作了总结。

传统分离脆性材料的技术由于易产生残余应力、显微裂纹与边部碎屑等缺陷，越来越不能满足半导体工业高精度与高清洁度的要求。激光微细加工技术以无污染、无接触及加工精度高、操作柔性好等优势，正成为一种很有潜力的脆性材料精密加工技术。介绍了用于分离脆性材料的几种典型激光微细加工技术，包括激光烧蚀切割技术、激光诱导张应力控制微裂纹扩展技术与激光剥离技术的工艺原理、特点及研究现状，指出了其存在的主要问题并探讨了其改进措施。最后预测了激光分离技术的发展前景。

本文简要介绍了准分子激光微加工的原理;分析比较了几种微检测技术的特点和用途;提出了采用显微拉曼光谱检测准分子激光微加工质量的新技术,并在有机玻璃和光刻胶制成的齿轮上分别进行了探索.研究结果表明:显微拉曼散射技术确实可以成为一种新的检测微加工质量的有效手段.