基于COMSOL的TSV电感多物理场耦合特性研究

基于硅通孔(TSV)技术, 提出了应用于三维集成电路的三维螺旋电感。在实际应用中, TSV电感存在电场、温度场和力场之间的相互耦合, 最终会影响TSV电感的实际电学性能。考虑P型和N型两种硅衬底材料, 采用COMSOL仿真软件, 对TSV电感进行多物理场耦合研究。结果表明, 在P型硅衬底情况下, 多物理场耦合的影响更大, TSV电感的电感值和品质因数的变化率可达14.13%和5.91%。

Abstract

Based on through-silicon via (TSV) technology, a spiral inductor for 3D integrated circuits was proposed. In the practical application, the electric field, temperature field and force field of the TSV inductor were coupled with each other, which would eventually degrade the actual electrical performance. Considering the effects of P- and N-type substrates, the effects of multi-physics coupling on TSV-based 3D spiral inductor were researched using COMSOL software. The results showed that the impact of multi-physical field coupling was much significant in P-type silicon substrate, and the variations of the inductance and quality factor reached as much as 14.13% and 5.91%, respectively.

参考文献

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尹湘坤, 刘景亭, 王凤娟. 基于COMSOL的TSV电感多物理场耦合特性研究[J]. 微电子学, 2022, 52(1): 115. YIN Xiangkun, LIU Jingting, WANG Fengjuan. COMSOL-Based Multi-Physical Field Coupling Characteristics for TSV Inductors[J]. Microelectronics, 2022, 52(1): 115.

基于COMSOL的TSV电感多物理场耦合特性研究

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