相较于传统的硅材料, 宽禁带半导体材料更适合制作高压、高频、高功率的半导体器件, 被认为是后摩尔时代材料创新的关键角色。单晶金刚石拥有大禁带宽度、高热导率、高迁移率等优异特性, 更是下一代大功率、高频电子器件的理想半导体材料。然而由于可获得单晶金刚石的尺寸较小, 且价格昂贵, 极大地阻碍了金刚石的发展。历经长时间的探索, 异质外延生长技术成为了获得高质量、大面积单晶金刚石的有效手段。本综述从金刚石异质外延的衬底选择、生长机理以及质量改善等方面对近些年来异质外延单晶金刚石的发展进行详细介绍。进一步地, 对基于异质外延单晶金刚石的场效应晶体管和二极管的研究进行了总结, 说明了异质外延单晶金刚石在电子器件领域的巨大潜力。最后总结了异质外延单晶金刚石仍需面对的挑战, 展望了其在未来的应用与发展前景。

氮化铝(AlN)具有超宽禁带宽度(6.2 eV)、高热导率(340 W/(m·℃))、高击穿场强(11.7 MV/cm)、良好的紫外透过率、高化学和热稳定性等优异性能,是氮化镓基(GaN)高温、高频、高功率电子器件以及高Al组分深紫外光电器件的理想衬底材料。物理气相传输(PVT)法是制备大尺寸高质量AlN单晶最有前途的方法。本文介绍了AlN单晶的晶体结构、基本性质及PVT法生长AlN晶体的原理与生长习性。基于AlN单晶PVT生长策略,综述了自发形核工艺、同质外延工艺及异质外延工艺的研究历程,各生长策略的优缺点及其最新进展。最后对PVT法生长AlN单晶的发展趋势及其面临的挑战进行了简要展望。

Using two-step method InP epilayers were grown on GaAs(100) substrates by low-pressure metalorganic chemical vapor deposition (LP-MOCVD). X-ray diffraction (XRD) and room-temperature (RT) photoluminescence (PL) were employed to characterize the quality of InP epilayer. The best scheme of growing InP/GaAs(100) heterostructures was obtained by optimizing the initial low-temperature (LT) InP growth conditions, investigating the effects of thermal cycle annealing (TCA) and strained layer superlattice (SLS) on InP epilayers. Compared with annealing, 10-period Ga0.1In0.9P/InP SLS inserted into InP epilayers can improve the quality of epilayers dramatically, by this means, for 2.6-micron-thick heteroepitaxial InP, the full-widths at half-maximum (FWHMs) of XRD 'omega' and 'omega'-2'theta' scans are 219 and 203 arcsec, respectively, the RT PL spectrum shows the band edge transition of InP, the FWHM is 42 meV. In addition, the successful growth of InP/In0.53Ga0.47As MQWs on GaAs(100) substrates indicates the quality of device demand of InP/GaAs heterostructures.