透明硬脆材料由于其优异的力学性能、热稳定性、耐腐蚀性以及光电性能，广泛应用于半导体与电子领域。传统透明硬脆材料切片方法效率低、材料损耗大，制约了硬脆材料的推广应用。激光剥离技术是近年来新兴的一种透明硬脆材料切片新方法，较传统金刚线切割方法大幅提升硬脆材料的切片效率和材料利用率，目前已发展成为硬脆材料激光加工领域学术研究与产业应用的焦点。文中深入分析透明硬脆材料激光剥离物理过程，归纳激光剥离过程关键科学问题：透明硬脆材料对激光的非线性吸收、激光作用下材料内部微观结构演化与缺陷扩展规律，以及激光光场调控对材料改质影响机制等。基于这些科学问题，综述了近年来激光剥离不同类型透明硬脆材料的研究进展，目前用于激光剥离的材料已涵盖了SiC、Si、GaN、金刚石等半导体材料，蓝宝石、多晶Al₂O₃、氧化锆等陶瓷材料，激光剥离技术已发展出超快激光双脉冲诱导剥离、超快激光-化学辅助剥离、多激光复合剥离等。激光剥离物理过程是一个典型的激光-材料-热学-力学多学科交叉问题，尽管在实验结果方面获得了显著突破和迅猛发展，但目前对于工艺机理仍缺乏深入的理论与数值建模研究。未来透明硬脆材料激光剥离技术将会朝着百微米以下超薄厚度剥离、改质层低损伤、工艺自适应等方向发展，将为半导体与电子等领域快速发展提供更大的技术支撑。

Overview: With the development of industry, laser fabrication has become one of the important technologies for welding, cutting, surface processing, and other advanced manufacturing areas. At the same time, the pursuit of structures miniaturization, devices integration, and high precision has put forward more stringent requirements for laser fabrication technologies. Due to the advantages of stable mechanical and chemical properties and unique photoelectric properties, hard and brittle materials have been widely used in aerospace, the photoelectric industry, et al. Laser fabrication is an ideal technology for hard and brittle materials processing due to its high precision, high energy, and non-contact properties. In order to achieve the removal of hard and brittle materials, high laser energy is usually required, resulting in low fabrication accuracy and poor surface quality. As an improved laser processing method, liquidassisted laser fabrication can effectively improve fabrication accuracy and surface quality. The processing characteristics and material removal principles of three different liquid-assisted laser processing technologies are summarized in this review. According to the different functions of the medium through which the laser penetrates and the kinds of liquid, liquid-assisted laser fabrication technology can be divided into Laser ablation in liquid (LAL), laser-induced backside wet etching (LIBWE), and etching-assisted laser modification (EALM). The auxiliary liquid of Laser ablation in liquid is mostly water, which mainly plays the role of cooling and removing debris. The auxiliary liquids used by laser-induced backside wet etching include organic solvents, acid-base solutions, inorganic salts, and other liquids, which play different roles according to different liquids. The etching-assisted laser modification mainly uses an acid or alkaline solution as an auxiliary liquid to remove laser-modified materials. Different methods and auxiliary liquids have different mechanisms in the methods. Therefore, almost any material can be processed by choosing suitable methods and auxiliary liquids, including photosensitive glass, silicon crystal, sapphire, and other transparent hard brittle materials. Here, we summarize the fabrication technologies and fabrication parameters for different materials. The development and applications of liquid-assisted laser fabrication technologies in the fields of micro-optical components, microfluidic devices, and drilling and cutting are introduced. Finally, the challenges of the technology are discussed.