压电与声光, 2020, 42 (4): 579, 网络出版: 2022-04-21
一种基于WLP封装的声表面波滤波器
A SAW Filter Based on Wafer Level Packaging
摘要
以41°Y-X切型铌酸锂作为基底材料, 选择双T型阻抗元结构, 采用晶圆级封装(WLP)技术,制作了一款相对带宽5.8%, 最小插入损耗为-2.8 dB, 体积为1.1 mm×0.9 mm×0.5 mm的小型化WLP封装声表面波滤波器。并研制了专用探卡, 对封装后晶圆完成在线测试。测试结果表明, 探卡测试结果与装配到实际电路的测试结果进行对比, 两者吻合较好, 解决了WLP封装声表面波滤波器测试难题。
Abstract
Using 41°Y-X LiNbO3 as substrate material, selecting the double T-type impedance element structure, and adopting the water level packaging technology, a miniaturized WLP packaged SAW filter with relative bandwidth of 5.8%, minimum insertion loss of -2.8 dB and volume of 1.1 mm×0.9 mm×0.5 mm is fabricated. A special probe card is developed to complete the test of the packaged wafer on-line. The test results show that the test results of the probe card are in good agreement with that of the wafer assembled into the actual circuit, which solves the test problem of WLP packaged SAW filter.
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陈尚权, 吕翼, 赵雪梅, 董加和, 米佳, 陈彦光, 伍平. 一种基于WLP封装的声表面波滤波器[J]. 压电与声光, 2020, 42(4): 579. CHEN Shangquan, LYU Yi, ZHAO Xuemei, DONG Jiahe, MI Jia, CHEN Yanguang, WU Ping. A SAW Filter Based on Wafer Level Packaging[J]. Piezoelectrics & Acoustooptics, 2020, 42(4): 579.
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